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Made of high thermal-conductivity materials (aluminum: ≥200 W/m·K; copper: ≥400 W/m·K), they quickly transfer heat from components. Optimized structures boost heat exchange, supporting loads from 30W to over 100W.
Passive models feature no moving parts for a service life of ≥10 years. Active models utilize durable PWM fans (MTBF ≥50,000 hours) capable of withstanding extreme conditions from -40°C to +125°C.
Passive designs operate at 0 dB, while active models feature intelligent PWM speed adjustment, maintaining a quiet 30–40 dBA during standard workloads.
Utilizing low-cost aluminum extrusion and copper-aluminum composites, these solutions reduce long-term TCO by 30–50% compared to liquid cooling over 5 years.
Available in versatile sizes from 50×50×15mm to 300×200×80mm. Compatible with screws, adhesives, or standard sockets like Intel LGA1700.
Highly recyclable materials (95% Aluminum, 100% Copper) meeting RoHS/REACH standards with low CO₂ emissions during production processes.
Simplified Applications of Heat Sink Devices
Heat sinks are essential in consumer electronics, industrial control, and automotive fields to prevent overheating. Below are key applications tailored to specific needs:
Passive aluminum sinks for low-power CPUs (35–65W) and active PWM fans for high-performance GPUs (100–150W). Ultra-slim designs (≤15mm) are used for modern laptops.
Consoles like PS5 use large aluminum sinks with centrifugal fans for 150–200W APUs. Mobile devices utilize tiny copper sinks or graphite sheets for high-power SoCs.
Passive aluminum-copper heat sinks cool power modules like IGBTs. These designs feature no moving parts to reduce maintenance and include corrosion-resistant coatings for harsh, dusty environments (-40°C to +85°C).
